Senior Mechanical Engineer (Electronics Packaging)

The Senior Engineer is responsible for the physical design and construction of ruggedized electronics and ruggedized electronics enclosures. The Senior Engineer is responsible to complete and contribute to the design, development, testing, qualification, and production support of products in a cost effective and timely fashion to meet the customer’s needs and schedules. The engineer shall work within a multi-disciplined organization and enlist the help of other disciplines when necessary, such as other engineers, manufacturing, purchasing, and quality assurance. Occasional light travel may be involved.

• Design and development of ruggedized electronics and electronics enclosures from a blank sheet of paper to meet customer requirements through all phases of product life cycle. Typical tasks include: 
  • Preliminary CAD design of electronics / electronics enclosures
  • Interface with electrical engineers to establish sizing of circuit card assemblies and selection of materials.
  • Ensure accuracy of all relevant drawings/documents on the project, except purely drafting technique issues.  This includes tolerance stack-ups.
  • Coordinate the creation of a preliminary bill of material in the business system and verifying its accuracy.
  • Perform, or coordinate and review, preliminary analytical results (Hand calcs and/or FEA)
  • Communicate technical and schedule problems, in a timely manner, to Engineering Manager / Director, Contracts Administrator, and Program Manager when applicable.
  • Disposition non-conforming hardware and assist with correcting production/vendor issues.
  • Lead / Participate in failure investigations of designs as required.
  • Create/Review and Approve processes for assembly, test, and related activities to the development and qualification testing of a design.
  • Interface with internal and external customers to determine product changes needed for applications as a representative of the company.
  • Write technical documents for internal and external customers.
  • Participate in design reviews (internal and external)
• Support new business pursuits that address program technical requirements and associated schedule and costs.
• Mentor and Guide Junior team members.

• B.S. in Mechanical Engineering is required (Advanced technical degree desirable).
• 5+ years design experience and technical knowledge in mechanical engineering design of electronics packaging preferably in aerospace or defense industry.
• Ability to solve complex mechanical static & dynamic problems.
• Works precisely, accurately, and pays close attention to all details.
• High level of mechanical aptitude and knowledge.
• Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)
• Excellent verbal/written communication skills required for multi-faceted interactions with all levels of personnel within the organization, as well as all outside agents, including but not limited to, vendors, suppliers, customers, potential job candidates, etc.
• Highly computer literate, with MS Office/PC expertise, and demonstrated experience with applicable systems, programs, equipment, etc.
• Design experience with electronic packaging approaches for defense and aerospace applications including: 
  • Design for high shock and high vibration environments.
  • Design for challenging thermal conditions.
  • Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).
  • Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.
  • Knowledge of high voltage / altitude design practices at the board and box-level.
  • Experience designing and testing designs to Mil-Std-810 Environments or similar (Humidity, Salt Fog, Vibration and Shock etc.)
• Experience with design for manufacturability.
  • Knowledge of machining operations, brazing, and additive manufacturing.
  • Knowledge of PWB and CCA fabrication
• Ability to prioritize and manage multiple tasks simultaneously.
• Experience performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.
• Must be a US Citizen

• Position entails exposure to typical manufacturing (i.e. Machine Shop, Assembly, Testing, etc.) environments inclusive of the appropriate eye, hearing and foot protection (as required).
• Business office environment requiring use of telephone and personal computer.
• Work under pressure and overtime when required, in order to meet deadlines.